Product Standard
ISO, NEMA, IEC, DIN, JIS
product Specification
|
F871 (Bismaleimide ) Modified Bismaleimide Glass Fabric Laminated Sheets |
||
|
Dimensions (LxW) |
1020*1220 |
MM |
|
1020*2040 |
MM |
|
|
1220*2470 |
MM |
|
|
Density |
1.80-2.00 |
g/cm3 |
|
Electric strength perpendicular to laminations (in |
≥18 |
kV/mm |
|
Breakdown voltage parallel to laminations |
≥35 |
kV |
|
Insulation resistance after 24 h water immersion, D-24/23 |
≥1.0×1010 |
Ω |
|
Water absorption rate, 1.5 mm in thickness |
≤71 |
mg |
|
Permittivity, 1 MHz |
≤5.50 |
- |
|
Dissipation factor, 1 MHz |
≤0.03 |
- |
|
Thermal resistance |
H |
CLASS |
Material: Modified Bismaleimide resin and a woven fiberglass
Color & Logo: white
F871 has high mechanical and dielectric properties, good heat resistance and radiation resistance. Thermal index TI≥180℃.
Thermal Class：H (180℃) It is commonly used for mechanical and electrical purposes, F871 is used for motor insulation, like slot wedges, carbon brush brackets, and other insulation structural parts in electrical equipment.
Product Applications
- Electronic equipment base board as the high frequency substrate materials, low dielectric constant of BMI resin (5.5) or less under 1 MHZ, suitable for 5 g high-frequency scenarios such as communication, radar system.
- The automotive industry for new energy automobile motor insulation slot wedge, battery pack protective structure, with high temperature resistance and impact resistance properties.
FAQ
FAQ
Q: 1.What are the differences from traditional epoxy resin laminates?
A: Higher heat resistance, lower thermal expansion, and better fatigue resistance compared to epoxy-based laminates.
Q: 2.What are the processing techniques?
A: Compression molding: Suitable for high-precision components, but the cost is relatively high. Hot stamping/laser cutting: Supports complex shape processing, and the surface can be chemically plated with gold to integrate conductive paths
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